Solder pallet materials are glass fiber composites specifically designed to meet the various challenges of the PCB assembly process. Features and benefits: (1) All materials are dimensionally stable and retain their flatness through repeated cycling in the PCB assembly process. (2) The low thermal conductivity of Solder pallet materials ensures optimal thermal distribution across the PCB. (3) The resin system used in Solder pallet materials provides resistance to the chemicals used in fluxes and also prevents solder pick-up. Solder pallet materials can be used for following applications in SMT assembly: (1) Solder paste printing
(2) SMT placement
(3) Reflow
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