Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary. Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.
Specifications
Target size: 2in to 3in
System control: PLC-based touch panel
Substrate holder size: normally up to 3in wafer
Substrate heating: basically not heated or water-cooled (optionally heated up to 300oC) Bias plasma applied to substrate holder (optional) Target to substrate distance: 60 to 100mm controllable
Sputter power supply: 600W RF power supply (13.56MHz) with matching circuit (DC power optional) Process gas: Ar, O2 (N2 optional) Vacuum gauge: low and high vacuum gauges
Base pressure: <5.0E-6Torr
Pumping system of TMP (51 l/s) +rotary oil pump (200 l/min) (dry pump is optionally available) Water: <20oC, 2kg/cm2, 20l/min
Compressed air: 5kg/cm2
Weight: 100kg
Dimension: 561mm (W) x 548mm (D) x 519mm (H)
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