Resin Bond Diamond Grinding Wheel has the featured of good self-sharpening, sharp cutting, high efficiency, low roughness of workpiece surface, few heat generating and no burning. They are mainly used for machining tungsten carbide, ceramic materials, magnetic materials, silicon materials, thermal spraying alloy materials etc. We can provide the diameter range is OD6-900mm; Thickness is 0.07-520mm; Grit size is 40/50~W2.
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